Monday, May 16, 2011

Latest Edition of Fieldbus Report

http://www.fieldbus.org/images/stories/fieldbus_report/supplement_spring2011.pdf

Here is a link to the latest Fieldbus Report.  It contains information on our recent General Assembly in Mumbai, new EDDL enhancements, new physical layer testing advancements, and a great customer success story.  The presdent's letter is particularly interesting because it points out that the Fieldbus Foundation is seeing increased business and end user acceptance as the global economy continues to improve.  Our membership increased by over 11 percent last year. You may also want to check out the articles on WIO and our new DesignMate tool for segment design. 

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